Backing plate for film formation devices
It is a backing plate used in a film-forming device.
This is a backing plate manufactured from C1020 (oxygen-free copper) for use in semiconductor equipment deposition systems. The shape has been formed using a milling machine, with some parts processed on a machining center. Due to the pocket machining and the resulting thin remaining plate thickness, this product is prone to warping and distortion; however, we have processed it to ensure that both flatness and planarity are within 0.1mm. In general, when processing copper, it is particularly noted that corners and similar areas are prone to scratches and dents during deburring. Therefore, at Copper Plate Processing.com, we carry out chamfering on thin areas using a machining center to ensure a tight fit during assembly. As such, processing copper often comes with unique challenges that require individual solutions. If you wish to process copper, please contact Copper Plate Processing.com. We will propose appropriate processing and treatment solutions.
- Company:アイジェクト
- Price:Other